Product News

ROHM Semiconductor announced that it has developed four new 600V IGBT Intelligent Power Modules (IPMs) as part of its BM6437x series that deliver best-in-class low noise characteristics, together with low loss, making them ideal for power conversion in inverters. The devices are used in compact

Flex Power Modules introduces the BMR474, a high power density, digital non-isolated Point of Load (PoL) regulator. Due to its vertically mounted SIP (Single Inline Package) design, the BMR474 saves valuable board space, while being able to deliver up to 80 A output current, with a maximum power

SCHURTER expands its range of current-compensated chokes for printed circuit board mounting, to include a vertical design for 1-phase high current applications. The new DKIV-1 sports a compact design and smaller footprint due to its vertical orientation. The series is available with a

Innovative Growers Equipment has selected Seoul Semiconductor ultraviolet (UV), white, and deep red (DR) LEDs for its latest lighting product, the ILE Radiance Spectrum UV6C horticultural lighting fixtures. The fixtures use the unique spectral properties of Seoul’s LEDs to produce an enhanced

Calex Manufacturing Company, Inc. announces it is extending its portfolio of rugged AC/DC products with the IHC600 Series. The IHC series is aimed at ruggedized fanless applications that require high reliability power operating in challenging environmental conditions. The compact single output

Configured with a powerful processor, ample storage, and an operating system, Small Form Factor (SFF PC) computers are becoming an essential part of the Industry 4.0 landscape, but present challenges in space-constrained embedded vision applications. To save space, SFF PCs are typically

Renesas Electronics Corporation announced that AMI, a firmware and software solutions partner, has qualified the Renesas I3C bus extension products for its MegaRAC SP-X Remote Management Firmware. Having the I3C devices on AMI’s approved vendor list enables an easy migration path for customers

TDK Corporation has released tiny high-power TVS diodes for ESD protection, extending its portfolio of components for bidirectional overvoltage protection of I/O interfaces. The space requirement of the so-called chip scale package (CSP) is just 400 x 200 µm² (CSP01005) or 600 x 300 µm² (CSP0201),

CUI Devices’ Switches Group announced the addition of slide switches to its product portfolio. Available in compact package sizes as small as 10 x 2.5 x 5.9 mm, the MSS series is a family of mini slide switches featuring 2.54 mm pitches, SPDT circuits, and on-on switch functions. Thanks to their

TTI, Inc., announces the availability of the full range of Micro-One Wire-to-Board Connectors with integrated ISL from stock at TTI. Molex’s compact Micro-One Wire-to-Board Connector with integrated ISL ensures proper terminal insertion and prevents accidental back-outs. This allows