Product News

­Toshiba Electronics Europe GmbH (“Toshiba”) launches the TLX9165T, an automotive photorelay in a 10-pin SO16L-T package, that achieves an output withstand voltage of 1800V (min.). It is designed specifically to support the battery management system (BMS) for high-voltage, 800V electric vehicle

­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its SRP4020T Series Shielded Power Inductors. This series features an advanced carbonyl powder core that offers excellent thermal stability and

­onsemi announced an expanded collaboration with leading motion technology company Schaeffler through a new design win that leverages onsemi’s next-generation EliteSiC product line of silicon carbide MOSFETs. The onsemi solution will power the Schaeffler traction inverter for

­A tightening market for electric generation capacity across the PJM region (which spans all or parts of 13 mid-Atlantic and Midwestern states, plus the District of Columbia) is driving up electric rates for consumers. This tight market is driven in large part by data centers, highlighting

­More safety, more convenience: advanced driver assistance systems (ADAS) are a major focus of the technological transformation currently taking place in the automotive industry, which is moving toward increasing levels of automated and autonomous mobility. Powerful radar sensors that equip vehicles

­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimized for high-performance Human Machine Interface (HMI) applications. Combining a quad-core Arm®

­Same Sky’s Thermal Management Group announced the expansion of its Peltier devices product line with the addition of new single-stage and multi-stage Peltier modules. The CP family of Peltier modules now offer sizes up to 76 mm and current ratings up to 40

­Magnachip Semiconductor Corporation announced the release of a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package. The Company has already begun supplying the new MOSFET to a leading global electric motor manufacturer. The TOLT-packaged MOSFET

­ADLINK Technology Inc., a global leader in industrial embedded platforms and edge computing, today announced the launch of the AmITX-RL-WV, a new Mini-ITX motherboard specifically engineered for industrial embedded systems deployed in environments with variable power conditions. Built

­KIOXIA Europe, a world leader in memory solutions, announced it has commenced sample shipments of 512Gb Triple-Level Cell (TLC) memory devices incorporating its 9th generation BiCS FLASH™ 3D flash memory technology. It plans to begin mass production in fiscal year 2025. The devices