Product News

­STMicroelectronics has revealed its contribution to accelerating widespread availability of secure, interoperable access-control technology to unlock doors and openings with smartphones, wearables, and other access-control devices. On February 26, the Connectivity Standards Alliance

­Anglia Components has signed a Pan European distribution agreement with Sensata, the global industrial technology company and leading provider of sensors, sensor-rich solutions, and electrical protection devices used in mission-critical systems. Anglia is focusing on Sensata's range

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, expanded its selection of 550/560 Series ultra-broadband capacitors to better satisfy surging cross-market demand for high-speed, high-bandwidth

­Ventiva®, a leader in thermal solutions, introduces a new architectural approach to thermal management that can transform how heat is managed in electronic devices. Ventiva's Zoned Cooling™ design uses the company’s ionic cooling technology to position airflow by zone and

­TDK Corporation extends its X2 safety film capacitor portfolio with the new B3292xU/V series, now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against

­Tark Thermal Solutions, the leading global manufacturer of thermal management solutions (formerly Laird Thermal Systems), announces the launch of two and three stage OptoTEC® MSX Series micro multistage thermoelectric coolers (TEC) engineered for high coefficient of performance (COP) in infrared

­Menlo Microsystems, Inc. announced the MM5627, the first switch in its category to combine 80 Gbps performance with high configurability, integrated DP3T logic, and fully integrated on-chip components. Designed for high-speed test and validation of AI GPUs, CPUs, and advanced semiconductor

­STMicroelectronics has introduced MasterGaN6, beginning the second generation of the MasterGaN half-bridge family. The new power system in package couples an updated BCD driver with a high-performance GaN power transistor that has just 140mΩ RDS(on). Leveraging the

­Emerson today announced the launch of the NI USRP X420, a software defined radio (SDR) designed to meet the demanding requirements of advanced radar systems, satellite communications, and emerging 6G research. The X420 expands the NI Universal Software Radio Peripheral (USRP) product

­KIOXIA Europe, a world leader in memory solutions, today announced that KIOXIA Corporation has begun shipping evaluation samples of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC. UFS 5.0 is