Product News

­Renesas Electronics Corporation unveiled the industry’s first I3C intelligent switch devices targeting next generation server motherboards and other infrastructure equipment. The new chips vastly enhance scalability and reliability while reducing the complexity of high-performance

­Security threats are growing in complexity and causing product development challenges in the Internet of Things (IoT), consumer, industrial, medical and other markets. It is imperative that these products have strong embedded security while also offering low power consumption for longer battery

­XP Power has released three new series of IP-rated wall-mount power supplies that deliver significant benefits to the rapidly growing home healthcare market. The devices suit a wide range of cost-sensitive industrial and medical applications while maintaining industry-leading performance. Increasingly,

­Power Integrations announced an expanded offering of the InnoSwitch 4-CZ family of high-frequency, zero-voltage switching (ZVS) flyback controller ICs. When paired with Power Integrations' ClampZero™ active-clamp IC and, optionally, the recently announced HiperPFS™-5 GaN-based

­With spring, temperatures are rising again to reach highs in summer. But rising temperatures also mean that it quickly becomes up to 70°C inside parked vehicles: A danger for animals and children left behind in the car. Equipped with the XENSIV 60 GHz automotive radar sensor (BGT60ATR24C) from

­NevadaNano announced the results of five years of continuous operation for its MPS Sensors. The sensors, manufactured and calibrated in early 2017 have been running continuously for 5 years. During this period there has been no additional calibration, and there has been no deterioration

­UTAC Holdings Ltd. (UTAC) is announcing a punch copper (Cu) clip packaging solution for power MOSFET market.  MOSFETs are key switching devices, used in every power application. To meet demanding thermal, efficiency and size challenges in end applications, performance of these

­Infineon Technologies Bipolar GmbH & Co. KG expands the high-power Prime Switch family with the new Press Pack IGBT (PPI) with internal freewheeling diodes (FWD) in Ceramic Disc Housings. This PPI is specifically designed for transmission and distribution applications and is ideal for high

­Mercury Systems, Inc. announced the new Avionics Modular Mission Platform (AMMP), the industry’s first and only SOSA aligned, DAL-certifiable, 3U OpenVPX™ mission computer. Featuring the latest Intel Core i7 safety-certifiable processors, AMMP delivers up to 40x more performance than

­Reducing size and cost were key concerns of Sensitron when designing their latest generation GaN power modules. By replacing traditional silicon FETs with EPC’s 350 V, EPC2050 GaN FET, Sensitron was able to reduce the size of their solution by 60% while also improving the module’s already