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Innoscience Expands its 100V Automotive-Grade Portfolio for the Automotive LiDAR Market

10/30/2024

­Innoscience Technology, the company founded to create a global energy ecosystem based on high-performance, price-competitive, gallium-nitride-on-silicon (GaN-on-Si) power solutions, has expanded its portfolio with two 100V automotive-grade GaN devices. The company’s INN100W135A-Q

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Würth Elektronik Expands its FPC Connector Family

10/30/2024

­The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger. The manufacturer of electronic and electromechanical components now offers WR-FPC ZIF connectors (Zero Insertion Force) with locking mechanism,

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Infineon Introduces DEEPCRAFT Brand for Edge AI Software Solutions and Launches new Ready Models

10/30/2024

­Infineon Technologies AG is further strengthening its AI software portfolio as Edge AI comes to a growing number of consumer and industrial applications. With that in mind, the company introduces DEEPCRAFT™, a new software solution category brand for Edge AI and Machine Learning. Infineon recognizes

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KIOXIA Begins Mass Production of Industry’s First QLC UFS Ver. 4.0 Embedded Flash Memory Devices

10/30/2024

­KIOXIA Europe GmbH today announced that it has begun mass production of the industry’s first Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.  QLC UFS offers a higher bit density than traditional

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Bourns Expands Shielded Power Inductor Portfolio with New Dual-Winding Series

10/29/2024

­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced a new cost-effective, space saving dual-winding shielded power inductor series. Bourns® Model SRF3015 Series features a low profile of

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Infineon Unveils the World's Thinnest Silicon Power Wafer, Pushing Technical Boundaries and Improving Energy Efficiency

10/29/2024

­After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has unveiled the next milestone in semiconductor

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High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components

10/29/2024

­NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the NSM211x, a series of automotive-grade fully integrated high-bandwidth, high-isolation current sensors that both ensure precise current measurement and eliminate

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Bourns Announces New Low 2.5 mm Profile Line Filter Series

10/28/2024

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced a new low profile line filter series. Featuring a compact 2.5 mm profile, Bourns® Model SRF0502 Series line filters are designed to meet

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SEGGER's Ozone Offers Enhanced Debugging with RISC-V Semihosting

10/28/2024

­SEGGER has expanded the capabilities of its debugger and performance analyzer, Ozone, by adding semihosting support for debugging RISC-V applications. This feature now enables RISC-V developers to use I/O to perform debugging tasks on the embedded system directly accessible by the host system,

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Toshiba Releases TCKE9 Series Compact Electronic Fuses for High-Voltage Power Management Applications

10/25/2024

­Toshiba Electronics Europe GmbH (“Toshiba”) has launched 2 new products to its electronic fuse (eFuse IC) offering. The TCKE903NL and TCKE905ANA products are reusable, thereby reducing maintenance costs and recovery time for equipment repairs, and support various functions to protect power

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Index