Product News

­congatec – a leading provider of embedded and edge computing technology – today introduced its new COM-HPC Client Size C module with AMD Ryzen™ AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical

­Siemens – together with NVIDIA and Fluence, and incorporating nVent-aligned design considerations – has developed an NVIDIA DSX Vera Rubin-aligned reference design that translates NVIDIA’s AI factory vision into a deployable, industrialized electrical, power and controls

­TDK Corporation presents the EP21 series (ordering code: B82552J*J021) of flat-wire double chokes. These components are designed for common-mode EMI filtering and are available in an SMD format with dimensions of only 23.8 x 17.7 mm and heights ranging from 21.6 to 22.3 mm. To minimize board

­Advanced Energy Industries, Inc., a global leader in highly engineered, precision power conversion, measurement and control solutions, today announced a new 1100 W board-mounted power factor correction (PFC) module — the industry's first solution of its kind in a half-brick form factor. Advanced

­Yokogawa Test & Measurement Corporation today announces the release of the WT1500 high-precision power analyzer. A new addition to the WT series, the WT1500 addresses a growing need for high-voltage, multi-functional measurement within the renewable energy and electrified vehicle (xEV) markets.

­WITT Gas Controls, a global leader in gas safety, control, and analysis solutions, has upgraded its proven dome pressure regulator product line with a next-generation design featuring optimized pilot pressure regulators. Engineered to maintain stable working pressure under widely varying flow

­Toshiba Electronics Europe GmbH (“Toshiba”) has launched the XPJ1R504PB, an automotive-compliant 40V, 120A N-channel power MOSFET housed in the S‑TOGL™ package, expanding its lineup for 12V systems. Target applications include inverters, semiconductor relays, load switches, and motor

­Bourns announces the release of its SRP2010PA, SRP2510PA, and SRP2512PA Series shielded power inductors designed to support high current operation in space-constrained electronic designs. The new series combines a metal-alloy powder core with shielded construction to reduce

­As industrial environments become more automated and connected, demand for Power over Ethernet is rising to enable industrial applications by delivering reliable power and data over a single cable, simplifying deployment and scalability. To offer an industrial-grade solution, Microchip Technology

­Emerson today introduced a new modular test architecture designed to address increasing complexity in software-defined vehicles. Built on NI-based technology, the automotive vision device combines a high-performance FPGA core with interchangeable serializer/deserializer (SerDes) interface devices,