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Bourns Expands High Power Thick Film Chip Resistor Line with Four New AEC-Q200 Compliant Series

01/30/2023

­Bourns, Inc., expanded its industry-leading line of high power thick film resistors with four new AEC-Q200 compliant product series. The new Bourns® Model CRM-Q, CRS-Q, CMP-Q and CHP-Q Series are automotive grade and feature high rated power and superior pulse

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SCHURTER Receives PSE-JET Approval for High-Performance SMD Fuses

01/30/2023

­SCHURTER product family types UMZ 250, UMF 250, UMK 250 according to IEC 60127-4 have received the Japanese PSE-Jet approval.  The newly marked packaging will be rolled out the first week of April 2023, date code 2314 or higher on the label.  SCHURTER offers a wide range

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Cincon's PDF700S Series AC/DC Brick Power Supply Now Shipping from Sager Electronics

01/30/2023

­Sager Electronics is now stocking Cincon's PDF700S series AC/DC brick power supply.  Cincon's PDF700S series are innovative, high density, 700W brick type AC-DC power modules with the input range of 90-264Vac, and output voltage of 12Vdc, 24Vdc, 28Vdc, 48Vdc, and 56Vdc.

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200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency

01/30/2023

­EPC introduces the 200 V, 10 mΩ EPC2307 in a thermally-enhanced QFN in a tiny 3 mm x 5 mm footprint. The EPC2307 is footprint compatible with the previously released 100 V, 1.8 mΩ EPC2302, the 100 V 3.8 mΩ EPC2306, the 150 V, 3 mΩ EPC2305, the 150 V, 6 mΩ EPC2308,

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STMicroelectronics Unveils World's First MCU Edge-AI Developer Cloud

01/30/2023

­STMicroelectronics is continuing to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster and with less complexity by aiding hardware and software decision-making. The STM32Cube.AI

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Teledyne LeCroy Extends CrossSync PHY Technology to USB4 and USB Type-C Connectors

01/27/2023

­Teledyne LeCroy announced the extension of their patented CrossSync™ PHY technology to USB4® signaling over USB Type-C® connectors. CrossSync PHY enables waveforms from Teledyne LeCroy oscilloscopes to be viewed alongside protocol analyzer traces, with complete time-correlation

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Isolated DC-DC Converters for xEVs Reduce Application Size and Minimize Noise Design Countermeasures

01/26/2023

­ROHM Semiconductor introduced the BD7Fx05EFJ-C isolated flyback DC-DC converter (BD7F105EFJ-C, BD7F205EFJ-C) optimized for gate drive power supplies in xEV applications, such as electric compressors and PTC heaters.  In recent years, xEVs such as hybrid and

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All-in-One Hybrid Power Drive Module Solution is Designed for Electric Aviation Applications to Reduce Development Time and Weight

01/26/2023

­Aircraft manufacturers designing More Electric Aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities. To meet the needs for an integrated and configurable power solution for aviation applications, Microchip Technology

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Renesas Introduces New Gate Driver IC for IGBTs and SiC MOSFETs Driving EV Inverters

01/26/2023

­Renesas Electronics Corporation announced a new gate driver IC that is designed to drive high-voltage power devices such as IGBTs (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) MOSFETs for electric vehicle (EV) inverters.  Gate driver ICs are essential components

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SiTime Expands Portfolio of Precision Timing Solutions for Aerospace and Defense with Two New Endura Oscillator Families

01/26/2023

­SiTime Corporation announced two new Endura precision timing oscillator families. These ruggedized devices are engineered to deliver high performance in extreme conditions in aerospace-defense applications such as Positioning, Navigation and Timing (PNT), tactical communications, network

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Index